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I'm asking about LGA 1155 Core i3, i5, i7 cpu.

I'm asking about LGA 1155 Core i3, i5, i7 cpu.
« on: September 19, 2012, 02:27:38 am »
I'm asking about LGA 1155 Core i3, i5, i7 cpu.
1. most of the OEM and some boxed new cpu are have dents in the form of small dots on the golden
contacts on the bottom of the cpu. and/or scratches, or thin dark lines on the metal lid of cpu. is it
normal, or it means that cpu was in use (used).
2. And I want to know. is the each brand new cpu has been inserted in socket of the motherboard or
something else at the time of testing at the factory, or not.
3. If it yes. that means, the all/almost all (OEM and Boxed) cpu must have dents/dots on the golden
contacts on the bottom of the cpu. But, what about cpu which do not have any dents/dots on bottom or
lines on lid of cpu (clean), what about it, please answer in detail.
4. Please tell me if you really know, how each cpu is tested on factory. Tell me about full process of
testing, if you can. If you can't, please give me some links.
5. If there difference between the ways of testing on different factorys or between model of cpu
(Pentium G8XX, i3, i5, i7),  please tell me about them.
6. I heard, there is some little difference in quality of cpu on factorys in the Costa Rica (Better,
more clean) and Malay (More scratches, little bit dirty).
Please answer in detail, i really wanna know. Because stores in my city usually have only OEM cpu, so
i can't distinguish new from used cpu. Each cpu looks almost the same.
Sorry for my english. Thanks.

Dark Mantis

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    • Dark Mantis
Re: I'm asking about LGA 1155 Core i3, i5, i7 cpu.
« Reply #1 on: September 19, 2012, 08:07:08 pm »
Hi,

I don't propose to go into depth on this but the CPUs are all tested on a pressure plate testpad and that is what makes the marks on the lands (copper plates) underneath the chip. This is why even new ones have these marks. As far as I know 100% are tested.

Maybe someone else can give you more detail.
« Last Edit: September 19, 2012, 08:08:24 pm by Dark Mantis »
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